Validating design kits requires investment and collaboration across the supply chain, but it pays off in fewer layout respins and lower risk.
A new technical paper titled “Modeling and Optimizing Performance Bottlenecks for Neuromorphic Accelerators” was published by ...
In-depth reports for the chip industry.
Hydrogel NAND gate; long-distance remote epitaxy; PAM-8 receiver.
CXL L0p demystified; DRC then and now; LLVM updates; where 6G and AI converge; just-in-time supply chains break down.
A new technical paper titled “Directed self-assembly of 3D interconnected networks” was published by researchers at MIT. Abstract: “Directed self-assembly (DSA) of block copolymers (BCPs) has long ...
A new technical paper titled “A Comparative Study of Digital Memristor-Based Processing-In-Memory from a Device and Reliability Perspective” was published by researchers at Northwestern University and ...
A new technical paper titled “Tiny Chiplets Enabled by Packaging Scaling: Opportunities in ESD Protection and Signal ...
A new technical paper titled “Toward Open-Source Chiplets for HPC and AI: Occamy and Beyond” was published by researchers at ...
The application of AI into design tools and flows will take several forms, each independent, but all potentially working together.
Keeping the hardware/software interface consistent across RTL, drivers, verification, documentation, and firmware.
Designing resilient chips with SLM can help combat aging effects, security threats, and get to market faster with higher ...
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