Abstract: In this work, shear creep tests for the ball grid array specimens with the diameter of 0.6 mm Sn-3Ag-0.5Cu (SAC305) solder bumps have been conducted at various temperatures (60 °C, 80 °C and ...
Are you tired of opening an image/text/office/archive application, paste what you just copied, hit save, select the folder manually and type the filename, just to realise your transparent GIF became a ...
Abstract: As the cornerstone of the electronics manufacturing industry, printed circuit boards (PCBs) often suffer from defects caused by solder paste printing issues during the soldering process.
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