3D-IC technology marks a pivotal shift from scaling in two dimensions to scaling in three. By bringing compute, memory, and ...

What’s 3D IC, and what’s causing the shift from 2D IC to 3D IC? How does this new technology relate to heterogeneous integration and advanced packaging? What is required for a successful 3D IC ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

Intelligent compaction (IC) technology represents a paradigm shift in pavement engineering by integrating advanced sensor systems, real‐time data processing and automated control to optimise ...