DIGITIMES

Exclusive: CSPs lock in memory capacity with two-year LTAs through 2028

Explosive AI demand is accelerating a historic global memory chip shortage, with major cloud service providers (CSPs) ...

Dell Pro Max 16 Plus launches with enterprise-grade discrete NPU for on-device AI

Dell has launched the Pro Max 16 Plus, a mobile workstation featuring an enterprise-grade discrete NPU for datacenter-class ...
Communications of the ACMOpinion

We Need to Teach the ‘Inuit’ Mindset to Young Computing Engineers

The survival mindset teaches programmers wise resource utilization and resilience in the face of change, attributes needed ...
IEEE

A Through Silicon Via (TSV) Architecture of the Bumpless Build Cube (BBCube) for Stacked Memory Devices

Abstract: This paper describes the architecture of the wafer-on-wafer (WOW) via-last through silicon via (TSV), named Bumpless Build Cube-TSV (BBCube-TSV). At first, the three types of TSVs, $\mu $ ...
Communications of the ACM

The TRIPS Project

This article provides a retrospective on one such case: the TRIPS project at the University of Texas at Austin. This project started with early funding by the National Science Foundation (NSF) of ...