Intel is planning to sock it to AMD's dominant X3D CPUs with a 52-core version of its upcoming Nova Lake processor.

Abstract: This paper describes the architecture of the wafer-on-wafer (WOW) via-last through silicon via (TSV), named Bumpless Build Cube-TSV (BBCube-TSV). At first, the three types of TSVs, $\mu $ ...

This article provides a retrospective on one such case: the TRIPS project at the University of Texas at Austin. This project started with early funding by the National Science Foundation (NSF) of ...