Infineon Technologies provides its OPTIGA Trust M security solution to Thistle Technologies for its new cryptographic protection for on-device AI models to its security software platform for embedded ...

XJTAG, a provider of test and programming solutions, has announced XJExpress and XJExpress-FPGA – a pair of Flash programmers perfect for development, debug and in-service applications. Designed to ...

NXP’s FRDM platform solution for accessible development tools bridges the gap between prototype and production. FRDM boards are designed with professional-grade capabilities in a cost-effective, ...

Mycronic’s MYPro A40 extends the capabilities of the company’s MY300 thanks to its high-speed MX7 mounthead technology, which places components up to six times larger than previous high-speed ...

Press-fit components offer a solder-free solution for PCB mounting by utilising a snug mechanical fit. In electronics manufacturing, optical inspection of these components is crucial to ensure the ...

Panasonic’s latest mounter, the NPM-GW, is designed to enhance production lines with the end goal of having a fully functioning autonomous factory. The mounter can respond to manufacturing needs that ...

Renesas has launched a new high-performance microprocessor for advanced human-machine interface (HMI) systems that are based on a real-time operating system (RTOS). The new RZ/A3M MPU integrates large ...

For the last few years Mycronic inspection customers have benefitted from a single web-based interface for unified SPI and AOI data. The latest MYPro Create software brings the same seamless ...

Manufacturing industries across South Africa face mounting pressure to reduce operational costs whilst meeting increasingly stringent environmental regulations. The path to achieving these goals lies ...

In manufacturing, the resilience of a supply chain often depends on its weakest point, and that point is frequently the supplier. Electrical components underpin almost every modern system, from ...

As electronic assemblies become more compact and performance demands rise, wire bonding has grown increasingly complex. Industries such as automotive electronics and 5G communications now rely on ...

Telecoms, Datacoms, Wireless, IoT AsiaRF unveils full Wi-Fi 7 ecosystem Bluetooth wireless SoC Bridging the future with RAKWireless WisNode devices Choosing a GNSS receiver Introducing Inpai Links ...