Abstract: One of the main difficulties that prevent the use of integrated circuits (ICs) with ball grid array packages in space is the early fatigue of their solder joints. Early solder fatigue ...

A friend of ours here at Hackaday has an audacious design in the works that we hope will one day become a prototype that we can feature here. That day may be a little while coming though, because it ...

Melexis' FIR temperature sensor range is designed for temperature monitoring of critical components in EV powertrain ...

According to projections from Towards Packaging, the global semiconductor and IC packaging materials market is set to ...

3D-IC technology marks a pivotal shift from scaling in two dimensions to scaling in three. By bringing compute, memory, and ...

Abstract: In order to inspect solder joint defects of integrated circuit (IC) components on printed circuit boards (PCBs), an automatic optical inspection (AOI) algorithm is developed. Firstly, ...

CNR-IENI, Department of Genoa, Via De Marini, 6 - 16149 Genoa, Italy, and DICAT - University of Genoa, Via Opera Pia, 15-16145 Genoa, Italy †Part of the special section “2008 European Conference on ...