Abstract: In order to inspect solder joint defects of integrated circuit (IC) components on printed circuit boards (PCBs), an automatic optical inspection (AOI) algorithm is developed. Firstly, ...

According to projections from Towards Packaging, the global semiconductor and IC packaging materials market is set to ...

Abstract: Developments of ultra fine pitch and high density solder microbumps and assembly process for low cost 3D stacking technologies are discussed in this paper. The solder microbumps developed in ...