According to projections from Towards Packaging, the global semiconductor and IC packaging materials market is set to ...
3D-IC technology marks a pivotal shift from scaling in two dimensions to scaling in three. By bringing compute, memory, and ...
Abstract: In order to inspect solder joint defects of integrated circuit (IC) components on printed circuit boards (PCBs), an automatic optical inspection (AOI) algorithm is developed. Firstly, ...
Abstract: This article presents a novel surface-mounted permanent magnet motor (SPMM) with hybrid NdFeB-Alnico magnets to achieve low cost and low torque pulsation. Based on the analysis of the ...
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