Meta’s latest custom AI chips promise major speed improvements, outpacing their predecessors in performance. Codenamed MTIA, these chips are specifically designed to accelerate the training of ranking ...

IC distributors are optimistic about AI-related chip and component demand, predicting a stronger second half of the year than the first. According to industry sources, consumer products, including ...

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence (Nasdaq: CDNS) today announced it is ...

A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.

The massive simulation ran on the Perlmutter supercomputer at the National Energy Research Scientific Computing Center (NERSC), a U.S. Department of Energy user facility. Perlmutter’s 7,168 NVIDIA ...