Seeing is believing: imaging and visualization capabilities of the iTero Element 5D Imaging System are designed to enable better patient engagement and lead to increased patient acceptance of ...
Broadcom Inc. has unveiled its revolutionary 3.5D eXtreme Dimension System in Package (XDSiP) platform, designed to empower consumer AI companies in developing advanced custom accelerators, or XPUs.
Optical data storage company SPhotonix has raised $4.5 million in a pre-seed funding round, led by Creator Fund and XTX ...
The technology is what is known as five-dimensional (5)D optical storage and it is one the University of Southampton team has been pursuing for a while. It was first demonstrated back in 2013, with ...
Broadcom Inc. today detailed a new chip packaging technology, XDSiP, that makes it possible to create processors by stacking multiple silicon dies atop another. XDSiP is short for eXtreme Dimension ...
United Rentals, Inc. and 5D Robotics, Inc. have teamed up to bring autonomous driving technology to United Rentals equipment operations. The 5D solution prevents collisions, enables multiple vehicles ...
PALO ALTO, Calif., Dec. 05, 2024 (GLOBE NEWSWIRE) -- Broadcom Inc. (AVGO) today announced the availability of its 3.5D eXtreme Dimension System in Package (XDSiP™) platform technology, enabling ...
GLOBALFOUNDRIES Introduces Certified Design Flows for Multi-Die Integration Using 2.5D IC Technology
MILPITAS, Calif.--(BUSINESS WIRE)--At next week’s 50th Design Automation Conference (DAC) in Austin, Texas, GLOBALFOUNDRIES will unveil a comprehensive set of certified design flows to support 2.5D IC ...
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